With the development of electronic technology, the efficiency of electronic components has been relatively improved, and the heat generation has become larger and larger, and heat sinks have emerged.

The heat sinks we usually use are aluminum extruded heat sinks, heat pipe heat sinks, liquid cooling plates, vapor chamber etc. But in fact, due to the development of heat dissipation technology and the complexity and diversity of heat sources, there are still many heat sinks that we can recognize, and we will introduce them one by one below.

Skiving Heatsink

Skived heat sink is the use of strip profile (aluminum, copper) through mechanical action, into a certain Angle to cut the material into pieces and more straight, repeated cutting to form a sort of consistent gap structure.

Different din thinness, fin gap minimum, fin tip planarity are the parameters for making different skiving heatsink.

The material of skiving heatsink is aluminum or copper.

(Copper skiving fin heat sink)

(Aluminum skiving fin heat sink)

Laminated Wire Mesh

Laminated wire mesh, the material usually is copper, which can make different mesh sizes, usually welded to the bottom plate.

Offset Strip Fin

Offset strip fin also called corrugated stamped fins, the shape is Lanced offset strip or continuous.

Sintered Copper

Can make multiple particle sizes

Can multi-layer stacking

Patterns & shapes can be designed according to customer requirement

Wide porosity range

High Density Forging

High Density Forging, also call cold forging heat sink is a technical process for forming and forging aluminum and copper profiles below the recrystallization temperature ( general is normal temperature). Cold forging materials are mostly aluminum, copper and some alloys with low deformation resistance and good plasticity at room temperature.

Copper Foam

Copper Foam is a new multifunctional material with a large number of connected or unconnected holes uniformly distributed in the copper matrix. Copper Foam has good conductivity and ductility, and its preparation cost is lower than that of foamed nickel, and its conductivity is better.

• Common thicknesses is 5, 6.35, 10mm

• Porosity 300-600microns

• Pores/cm 10-25

• 5-37% density

Stacked or Snapped fin

A zipper fin stack is constructed from a series of individual sheet metal fins that are stamped, folded, and zipped together using interlocking features. Fin lengths and gaps within a stack can vary by using different stamping dies and fins can be closed, creating a finned duct with the zipper fin stack, or open for multi direction air flow depending upon application airflow requirements.

Copper joined into aluminum baseplate

Weld the copper heat sink to the aluminum plate, or weld the aluminum heat sink to the copper plate. As the thermal conductivity of copper is higher than that of aluminum, this design can better for heat conduction and heat dissipation.

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